0.5mm Thickness Panel Level Packaging Panel Level BGA/CSP For Power Adapter

Description:

310*320mm panel size;

Package size: 2.0*2.0mm;

Package thickness: 0.5mm;

Chip size: 1.0*1.6mm;

Process type: FOPLP (Face Up);

Process introduction:

After the chip is picked and placed onto the temporary carrier board, the packaging process is carried out by compression molding, plasma clean, laser opening/double-sided sputtering(Ti/Cu), and then continue to perform double-sided lithography/electroplating. Finally the plastic compression molding is carried out again, and then OSP is performed on the pad surface, and after that a final package is completed and final product is shipped to the customers.

Applications:

Power adapter, power amplifier, automotive electronics, etc

Specifications:

310*320mm panel size;

Package size: 2.0*2.0mm;

Package thickness: 0.5mm;

Chip size: 1.0*1.6mm;

Process type: FOPLP (Face Up);

Competitive Advantage:

1,Low electrical resistance , such as 0.1,0.2 mohm

2,Low power consumption

3,High efficient heat dissipation

4,Thin package

5,Low price

0.5mm Thickness Panel Level Packaging Panel Level BGA/CSP For Power Adapter Images