Fan-Out Panel Level Packaging (FOPLP) Product Structure Embedded Package

Description:

1,Compared with traditional packaging methods, this advanced packaging replaces wire bond and substrate, therefore, it has demonstrated the characteristic of higher integration, high reliability, and low cost ;

2,While maintaining the original foot position design, it is much thinner and lighter and has small outline and save more space for consumer electronics;

3,It has successfully optimized traditional processes such as DFN/QFN and can be used in a variety of application scenarios.

4. As shown in above photo, the package does not contain wire bond and substrate, the RDL is obviously short and circuit has more thinner and connection is much shorter so that the resistance is much lower.

Competitive Advantage:

Low cost, high integration, thin and light structure.

Fan-Out Panel Level Packaging (FOPLP) Product Structure Embedded Package Images